RD Chemical is known as the "Innerlayer Chemistry Company" supplies
application-specific process chemicals for the Printed Circuit Board, Chemical
Milling, and Semiconductor Packaging Industries.
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TerClean (RD-01) A general purpose orange Terpene based
cleaner.
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HASL Pre-Cleaner SL (RD-08) An alkaline pre-HASL (or
alternative finish) cleaner.
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MicroClean ZE (RD-10) A low foam cleaner/nanoetch; replaces
microetch before HAL.
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FlexClean DM (RD-11) Powerful, non-foaming, free rinsing,
buffered alkaline cleaner for flex circuits. Organic substrate attack inhibitor.
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MicroClean NE (RD-15) A low foam cleaner/nanoetch, spray or
immersion, low metal pickup.
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MicroClean S (RD-17) Copper Cleaner/Oxide and Chromate Remover.
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MicroClean CuL (RD-19) An alkaline spray cleaner for cleaning
copper & iron alloy foils.
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DefoamerA (RD-28) A fully organic non-Silicone water soluble
defoamer for full aqueous resist strippers. Cost-effective and free rinsing.
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ChemStrip NXT (RD-30) A single part, high capacity nitric
acid-based stripper.
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Equipment Cleaner (RD-34) All purpose product for removal of
water hardness, photoresist and metal salt deposits from chemical processing
equipment
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In-Process Defoamer (RD-36) Fully organic non-Silicone water
soluble defoamer for use in developers or other spray systems where clean
rinsing is essential.
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ChemStrip 99 (RD-37) Liquid additive to nitric acid rack
strippers.
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Sodium Carbonate, PhotoResist Developer (RD-39) Economical dry
form, hydrated Sodium Carbonate which dissolves readily in water.
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Developer HC (RD-41) Highly concentrated, for full aqueous dry
film photoresists.
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Developer Defoamer (RD-43) Water soluble defoamer, non-Silicone,
for use in developers or other spray systems.
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ChemPosit Sn (RD-51) Immersion "White" Tin Final Finish.
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ChemStrip TL (RD-52) An ultrafast one-step tin/lead stripper for
immersion or spray applications.
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ResiStrip L (RD-56) A long-lived alkaline stripper for
full-aqueous dry film photoresist; long life, no tarnish.
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ChemPrep (RD-58)Multipurpose, high activity copper surface prep.
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ResiStrip (RD-61) High-Speed Alkaline Stripper for Semi- or
Full-Aqueous Dry Film Photoresist
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TinPlate R/T (RD-63) Liquid low temperature immersion tin
plating for copper, tin/lead and other metals.
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MicroClean CuLX (RD-68) An alkaline soak cleaner for cleaning
copper & iron alloy foils; powerful, non-tarnishing.
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Silicone Defoamer (RD-71) A concentrated defoamer for use in
waste water treatment.
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ResiStrip PC (RD-76) A high speed dry film photoresist stripper;
small particles.
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Circuit Prep (RD-81) A preplating cleaner for use with dry film
photoresist.
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SatinEtch (RD-83) A cost-effective fine-definition etch process
for use prior to plating or oxide deposition.
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Unietch (RD-84) Microetch for copper.
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MaskStrip (RD-85) High capacity solder mask stripper.
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HAL Flux (RD-88) The definitive flux for any type of Hot Air
Leveled circuit board.
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ResiStrip A (RD-96) A high-speed stripper for full aqueous
photoresist.
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UltraDeveloper (RDX-1076) Developer & cleaner for full aqueous
dry film photoresists & soldermasks.
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Paladin (RDX-1200) Immersion Palladium plating bath, for Flat
Final Finish.
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Paladin Catalyst (RDZ-1354) Catalyst for electroless nickel,
only catalyzes copper, not laminate or soldermask.
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ResiStrip™SP (RDZ-1398) A High Speed Dry Film Photoresist Stripper.
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De-Ox (RDZ-1556) A Cleaner/Deoxidizer for Electrical Contacts.
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ResiStrip™ EC-1 (RDZ-1590) Very Low Cost, Innerlayer Photoresist
Stripper.
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ResiStrip™ EC-2 (RDZ-1591) Very Low Cost, Small Particle Innerlayer
Photoresist Stripper.
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ResiStrip™ EC-3 (RDZ-1592) The Low-Priced Small Particle Innerlayer
Photoresist Stripper.
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Aluminum Cleaner (RDZ-1593) Cleaner/desmut for Aluminum alloys for
Disc Drives.
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ChemBond™ EC (RDZ-1601/1602) Oxide Replacement The Alternate
Oxide for Lamination Adhesion.
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MicroClean™ EC-1 (RDZ-1603) Acid Copper Cleaner/Oxide and Chromate
Remover.
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MicroClean™ EC-2 (RDZ-1604) Acid Copper Spray Cleaner.
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MicroClean™ EC-3 (RDZ-1605) An Alkaline Spray Cleaner for cleaning
Copper Foils.
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MicroClean™ EC-4 (RDZ-1606) Acid Copper Cleaner/Oxide and Chromate
Remover.
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Developer EC-1 (RDZ-1607) For Full Aqueous Dry Film Photoresists.
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Developer EC-2 (RDZ-1608) For Full Aqueous Dry Film Photoresists.
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Developer EC-3 (RDZ-1609) Sodium Carbonate Monohydrate.
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Defoamer EC-D (RDZ-1610) Non-Silicone for Photoresist Developers.
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Defoamer EC-S (RDZ-1611) To Defoam ResiStrip™ EC-1.
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Defoamer EC-S2 (RDZ-1612) Non-Silicone, for use in Photoresist
Strippers or other Spray Systems.
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Nitinol Polish (RDZ-1616) Nitinol Deoxidizer-Polish.
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ChemPolish™ DD (RDZ-1627) For Particulate Removal From 300 Series
Stainless Steel.
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Aluminum DCPR (RDZ-1642) Aluminum Deoxidizer/Desmut for Disc Drives.
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HAL Flux EC2 (RDZ-1643) The low cost flux for any type of Hot Air
Leveled circuit board.